TELEFUNKENSEMI.COM - Company News

Hocheffektive Leistungswandlung für Solaranlagen

Wed, 08 Feb 2012 19:19:00 +0300

Die Solarenergie birgt ein unerschöpfliches Potential zur Sicherstellung unserer zukünftigen Energieversorgung. Der Schlüssel zur Nutzung dieses Potentials liegt darin, die Solarenergie mit höchster Effektivität in elektrischen Strom umzuwandeln, um einen bedeutenden Beitrag zu einer nachhaltigen und kostengünstigen Energieversorgung zu gewährleisten. Ein Konsortium aus führenden Industrieunternehmen und Forschungspartnern hat sich das Ziel gesetzt, die Umwandlungsverluste deutlich zu reduzieren und die Kosten der Solarstromerzeugung weiter zu senken. Das Bundesministerium für Bildung und Forschung (BMBF) unterstützt seit August 2011 die deutschen Partner mit rund drei Millionen Euro im Rahmen des Forschungsprojekts ENERGY FOR A GREEN SOCIETY (ERG). Das Projekt hat eine Laufzeit von drei Jahren.

Eingebettet in das europäische Rahmenprogramm ENIAC und gefördert vom BMBF arbeiten die deutschen Unternehmen Telefunken Semiconductors, Infineon Technologies, SMA Solar Technology und Elec-Con technology GmbH, sowie die Forschungseinrichtungen Fraunhofer Gesellschaft IIS, RWTH Aachen und TU Chemnitz in einem Konsortium von 27 europäischen Partnern an innovativen Technologien. Die Forschungsfelder des Projekts ERG reichen von der Innovation in der Fotovoltaik, über die Umwandlung in elektrische Energie, bis hin zur Netzeinspeisung in das zukünftige intelligente „Smart Grid“. Die Arbeiten der deutschen Partner fokussieren sich dabei auf den Bereich der effektiven Energieumwandlung. Die geplanten Zielanwendungen sind hocheffektive und gegenüber den bisherigen Lösungen deutlich kostengünstigere Solaranlagen sowie Anlagen auf Basis der Konzentratortechnik, die das einfallende Licht – ähnlich einer Sammellinse – bündelt und mit hoher Energieausbeute in elektrische Energie umwandelt.

Erhöhung des Wirkungsgrads und Senkung der Kosten

Durch kontinuierliche technologische Innovationen ist die Fotovoltaik über die vergangenen Jahrzehnte effektiver und kostengünstiger geworden. Das Konsortium hat sich als herausforderndes Ziel vorgenommen, die Verluste, die den Wirkungsgrad beim heutigen Stand der Technik noch schmälern, um weitere 20% zu verringern und durch geringeren Materialeinsatz die Kosten deutlich weiter zu senken. Die Verbesserungen sollen vor allem durch Nutzung neuer Halbleiterkomponenten, neuer Konzepte im Wechselrichter sowie neuer Kommunikations- und Ansteuerschaltungen erfolgen. Außerdem werden optimale Systeme für die Konzentratortechnik erforscht. Europäische Vernetzung Das Thema „Effektive Energiewandlung“ ist im europäischen ENIAC-Konsortium so vernetzt, dass sich Forschungsergebnisse der solaren Energieerzeugung unmittelbar aufnehmen, erproben und direkt umsetzen lassen. Die deutschen Partner decken dabei die Wertschöpfungskette für Solarenergiewandler ab. Neben den ökologischen Zielsetzungen wird durch konkrete Verbesserungen auch die wirtschaftliche Position der europäischen und besonders der deutschen Industrie gestärkt und für zukünftige Wettbewerbssituationen vorbereitet. Die Ergebnisse des Projektes sollen anschließend in der Produktentwicklung der Partner genutzt und in eine Fertigung mit hohen Stückzahlen umgesetzt werden.

GOEPEL electronic and TELEFUNKEN Semiconductors accelerate deployment of system-level JTAG applications

Tue, 15 Nov 2011 00:00:00 +0300

Jena; Munich – today during the 2011 Productronica trade fair GÖPEL electronic, the worldwide leading supplier of JTAG/boundary scan solutions based on IEEE1149.x announced support for the TELEFUNKEN Semiconductors TF112 JTAG scan-path multiplexer. The TF112 is a new 7 port multidrop multiplexer that facilitates multiple scan chains for complex cards and system level boundary scan. Göpel’s proprietary boundary scan software tool SYSTEM CASCON includes a unique scan-router-functional library that provides automated addressing and routing of multiple scan paths even in hierarchical configurations. The new tool provides fully automated boundary scan testing, in-system programming and emulation for both board and system level. “By developing this new function library for automated control of the TF112 we are not only supporting these powerful IEEE1149.1 multiplexers from TELEFUNKEN Semiconductors but stimulating the use of hierarchical multi-drop architectures for improved test and programming of complex boards and systems” said Thomas Wenzel, General Manager of the Boundary Scan Division of GÖPEL electronic. “The combination of our proprietary software tools together with the scan-multiplexer products from TELEFUNKEN Semiconductors provides the user with enhanced and innovative capabilities within a known and proven framework”. “We are extremely pleased to be working with GÖPEL, the market leader for professional JTAG/Boundary Scan solutions as a partner on present and future innovative solutions”, pointed out Herbert Scheitler, Director of European Sales for TELEFUNKEN Semiconductors. Added Marketing Director Ken Filliter, “After the initial step with the TF112 we expect to provide users with continued improvements using these aligned software and hardware tools”. The TF112 functional library supports the entire development sequence, beginning with the automatic recognition of the scan-path coming from CAD-data, the automatic-test-pattern-generation (ATPG), followed by pin-error level diagnostics (PFD), graphical failure localization and debugging, as well as in-system programming (ISP) of FLASH/PLD/MCU all in an integrated environment. Boundary scan operations involving multiple TF112s will be totally transparent and synchronized. This fully automated flow eliminates the need for manual jumpers improving efficiency time and reducing the chance of error. The SYSTEM CASCON tool handles secondary scan paths in a dynamic manner, and one, multiple, or all of the associated TAPS may be active at one time. The tool makes use of the PARK and UNPARK instructions to control various TAPS as needed. There is no need for manual designation of scan paths and instead the ATPG tools both generate the test vectors and control the TF112s for board level interconnect and card-to-card testing over backplanes or cables. CPLD programming on secondary scan chains is likewise automated including programming via IEEE1532, SFV, or JAM/STAPL. JTAG/IEEE1149.1 testing as well as AC-JTAG, IEEE1149.6 for AC-coupled nets is available. The new software library functions for the TF112 are SYSTEM CASCON version 4.6 integrated as a standard and will be activated via license manager. The release is available now and free of charge for users with existing software licenses. http://www.goepel.com/news/details/article/2011/11/15/goepel-electronic-und-telefunken-semiconductors-forcieren-einsatz-von-systemlevel-jtag-applikatione.html

TELEFUNKEN Semiconductors has reached signifitant results for its position in smart-power technologies

Wed, 14 Sep 2011 17:57:00 +0400

Combining sophisticated control logic with the management of high voltages and currents, smart-power technologies are at the leading edge of semiconductor design worldwide. The challenge for the designer is to meet the increasing demand for both voltage handling and greater integration-without sacrificing quality and product lifetimes. The MEDEA+ project SPOT-2 aimed to develop innovative and cost-effective power handling technologies for such applications, while maintaining and stabilising the position of European semiconductor manufaturers in increasingly competitive global markets.

TELEFUNKEN Semiconductors coordinated this project and worked in partnership with companies Atmel, Audi, Robert Bosch, Bruco, Continental Automotive, Infineon, LAAS-CNRS, NXP, ON Semiconductor, SOITEC, TU-Vienna and X-FAB. The project was supported by the German Federal Ministry of Education and Research (BMBF) within the program IKT 2020 under grant contract SPOT-2, 13N10330.

Read more at http://www.catrene.org/web/downloads/results_medea/2T205-SPOT-2-result-final%20%2813-5-11%29.pdf

Setron and TELEFUNKEN Semiconductors sign distribution agreement

Tue, 24 May 2011 17:56:00 +0400

Brunswick, 24 May 2011 - The Brunswick distributor setron and TELEFUNKEN Semiconductors, a traditional electronics manufacturer company located in Germany, have signed a European franchise agreement for sales of semiconductor products.

Setron expands its portfolio to include technologically advanced products in the areas of power management and mixed-signal technology. TELEFUNKEN Semiconductors is a leading manufacturer of advanced BiCMOS, BCD and Bipolar on SOI technologies with their own product development groups.TELEFUNKEN Semiconductors service strategic foundry partner worldwide and have qualified automotive manufacturing plants in Heilbronn (Germany) and Roseville (USA). To expand capacity and fuel growth, TELEFUNKEN Semiconductors International recently acquired a 200-mm, (eight-inch) fab located in Roseville, California. The state-of-the art facility will be used for production of TELEFUNKEN products in the areas of analog/mixed signal and High Voltage (HV). TELEFUNKEN Semiconductors International LLC, the holding company of TELEFUNKEN Semiconductors GmbH & Co. KG and Renesas Electronics Corp. signed the formal acquisition of the eight-inch fab on 2nd May 2011. A special highlight is the availability through setron of the TELEFUNKEN family of DC-DC synchronous buck regulators, TF6002X family, which allow a regulated power supply with very high efficiency. The product family includes devices such as the TF6001, TF6002 and TF6003, which can operate with input voltages from 4.5V to 26V and provide adjustable regulated current outputs of 1A, 2A and 3A. With efficiency of up to 93 percent, and low standby current, these products have been optimized for achieving improved overall efficiency and thus ensure compliance with climate protection requirements for end-use applications. The product family consists of TF600X current mode synchronous buck converters with a fixed frequency, utilizing an SOI-BCD process (“Silicon on Insulator") and providing industry-leading performance and durability with high reliability.

"We are delighted to have found setron, a partner with complimentary expertise and customer focus," said Herbert Scheitler, Director Sales Europe at TELEFUNKEN Semiconductors GmbH & Co. KG. "As a company with high quality products and a long-term tradition for semiconductor manufacturing, we are confident that setron will represent us very well with their market knowledge and years of experience."

"The optimum combination results from our cooperation, allowing both parties to meet or exceed the technical requirements of industrial customers and respond appropriately to changing market conditions" said Andreas Lausch, Director of Marketing / Purchasing setron.

TELEFUNKEN products can be obtained from setron immediately.

More information about setron and their product range is available at www.setron.de.

setron has for over 40 years been an independent distributor of electronic components in the areas of semiconductors, passive and electromechanical components. Setron services industrial and commercial customers from the modern logistics center in Brunswick throughout the world.

Renesas Electronics Announces the Completed Sale of Its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors

Mon, 02 May 2011 17:52:00 +0400

TOKYO, SANTA CLARA, Calif., and HEILBRONN, Germany, May 2, 2011—Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, its subsidiary Renesas Electronics America Inc., and TELEFUNKEN Semiconductors GmbH & Co. KG, an automotive-qualified, mixed-signal, high-voltage (HV) power management and SOI-based manufacturer, today announced that the sale of Renesas Electronics America’s semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN Semiconductors International LLC, a company that includes TELEFUNKEN Semiconductors GmbH, has been completed as of May 2, 2011. (First announced March 30, 2011: www.am.renesas.com/press/news/2011/news20110330.jsp). As part of the strategies decided through its 100-Day Project announced on July 29, 2010, Renesas Electronics has been implementing various measures to improve manufacturing efficiency by promoting larger wafers, finer process nodes, and production concentration. In line with these measures, the company decided to sell Renesas Electronics America’s facility in Roseville, California, to TELEFUNKEN Semiconductors International, which was searching for a new manufacturing facility to expand its semiconductor business. TELEFUNKEN Semiconductors International intends to utilize the 200-millimeter (eight-inch) line at the Roseville factory to manufacture its own analog/mixed-signal, HV products and products for its strategic foundry partners. TELEFUNKEN Semiconductors International also entered into a supply agreement with Renesas Electronics for manufacturing services at the Roseville factory. Under this agreement, TELEFUNKEN Semiconductors International will manufacture products without interruption at the Roseville facility intended for Renesas Electronics’ current customers, using the same high-quality level of production and service. Renesas Electronics remains fully committed to meeting customers’ requirements through its Quality Assurance Center at the Roseville facility to continue its customer support in the North American and European markets. TELEFUNKEN Semiconductors International is looking to expand the manufacturing capacity of the fab to increase wafer production as well as bringing in key technologies to offer broader manufacturing capabilities to its customers.

Download Press release (PDF)

Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors

Thu, 31 Mar 2011 17:51:00 +0400

TOKYO, Japan, and Heilbronn, Germany, March 31, 2011-Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and TELEFUNKEN Semiconductors GmbH & Co. KG, an automotive-qualified, mixed-signal, high-voltage (HV) power management and SOI-based manufacturer, today announced that they have signed an agreement under which Renesas Electronics America Inc. will sell its semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN Semiconductors International LLC, a group company of TELEFUNKEN Semiconductors GmbH & Co. KG. The sale price is approximately 53 million U.S. dollars, and the closing for the sale is planned for May 2, 2011. Wafra Capital Partners L.P. and Somerset Capital Group Ltd. helped TELEFUNKEN finance and facilitate the transaction, and ATREG Inc. advised Renesas Electronics throughout the transaction.

As part of the strategies decided through its 100-Day Project announced on July 29, 2010, Renesas Electronics has been considering and implementing various measures to improve manufacturing efficiency by promoting larger wafers, finer process node, and production concentration. In line with these measures, the company decided to sell Renesas Electronics America's facility in Roseville, California, to TELEFUNKEN Semiconductors International, which has been searching for a new manufacturing facility to expand its semiconductor business.

TELEFUNKEN Semiconductors International intends to utilize the 200-millimeter (mm), eight-inch line at the Roseville factory to manufacture its own analog/mixed-signal, HV products and the products for its strategic foundry partners. TELEFUNKEN Semiconductors International also will enter into a supply agreement with Renesas Electronics for manufacturing services at the Roseville factory. Under this agreement, TELEFUNKEN Semiconductors International will focus on Renesas Electronics' current customers without interruption for the same high-quality level of production and service at the Roseville facility.

Renesas Electronics remains fully committed to meeting customers' requirements through its Quality Assurance Center in Roseville to continue support of customers in the North American and European markets.

Note: Refer to the addendum for an overview of the sale agreement of the Roseville factory.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723), the world's number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.

Download Press release (PDF) Download Press release in german (PDF)

http://www.sacbee.com/2011/03/31/3516212/renesas-electronics-sells-roseville.html

http://www.stimme.de/heilbronn/wirtschaft/sonstige;art2088,2101294

TELEFUNKEN SEMICONDUCTORS – Releases High Voltage Family of Synchronous Buck Regulators with up to 26V Input and 93% efficiency

Wed, 15 Dec 2010 17:50:00 +0300

TELEFUNKEN Semiconductors today announced the release of its TF600X family of high voltage DC-DC synchronous buck regulators to deliver very high efficiency regulated outputs. The family consists of three parts TF6001, TF6002 and TF6003 that operate from 4.5V to 26V Input and provide 1A, 2A and 3A adjustable regulated outputs. Achieving efficiencies up to 93% and with low standby currents these products are optimized to provide the designer with improved overall efficiencies thereby enabling systems to comply with Green Energy Requirements in end applications.

The TF600X family is a current mode, fixed frequency synchronous buck regulators manufactured on a SOI (Silicon on Insulator) BCD process that offers best in class performance and ruggedness with high reliability. The regulators operate at 340 KHz fixed frequency and the current mode control architecture enables fast transient response. The high and low side MOSFETS are integrated with Rds of 140m-Ohms for TF6001, 130m-Ohms for TF6002 and 100m-Ohms for TF6003. The low Rds switches help the regulators achieve a peak efficiency of 93%. The adaptive, non-overlapping MOSFET gate-drivers and high-side bootstrap structure helps to further maximize efficiency. Output voltage is adjustable down to 0.923 V with a set of external resistors with 2.5% voltage reference accuracy over -40°C to 85°C operating temperature range. The TF600X family is targeted at point of load applications in consumer and computing end products such as Digital TV’s, Blu-Ray DVD Players, xDSL Modems, Set Top Boxes, Notebooks and Netbooks. The products have built in soft start, under-voltage lockout, over-current, and thermal shutdown protection to help protect the device from damage during fault conditions. TF6001 and TF6002 are offered in 8 pin SOIC Package and the TF6003 in 8 pin SOIC with exposed pad package for improved thermal dissipation. The TF6001, TF6002 and TF6003 are priced at $0.79, $0.89 & $0.99 in 1K quantities. www.telefunkensemiconductors.com/products/index.html. click here to download this information

TELEFUNKEN Semiconductors offers Epitaxial Deposition Services for customers

Thu, 21 Oct 2010 17:43:00 +0400

TELEFUNKEN Semiconductors announces today the availability of high quality in-line Si and SiGe epitaxial deposition servicefor customers, commercial and non-commercial, worldwide to address growing in-line epitaxial layer market requirement for the high speed amplifier and power driver applications. “We are ready to provide high quality silicon and silicon-germanium epitaxial service to support our 150 mm wafer customers. As we know, epitaxy is a key enabling technology for today's high performance devices,” said Dr. Volker Dudek, CTO of TELEFUNKEN Semiconductors. TELEFUNKEN Semiconductors’ state-of-the-art Fab has both single wafer reactors and batch wafer reactors tools to meet various in-line epitaxial requirements. The epitaxial service offers Si epitaxial and ultra-thin SiGe:Si composite layers on buried doped regions. We also provide comprehensive metrology services for our customers. The range of epitaxial thickness can vary from below 20nm to 9µm with resistivity from 0.005 ?cm to 15 ?cm. By outsourcing the epitaxial growth process to TELEFUNKEN Semiconductors, customers can benefit greatly from the elimination of expensive equipment investment and significant operation and maintenance costs. Being expert in Silicon Germanium processing and standard epitaxial service, TELEFUNKEN Semiconductors is the best choice for successfully growing semiconductor business. click here to download this information

TELEFUNKEN Semiconductors returns to the IC Business

Tue, 14 Sep 2010 17:42:00 +0400

TELEFUNKEN Semiconductors returns to the IC Business Speciality In-house Fabrication Enables Leading-edge Power Management and Interface Devices

TELEFUNKEN Semiconductors today announced a re-entry into Integrated Circuits (ICs) with a focuson Power Management and high performance Interface. The newly released products emphasize power savings and are fabricated at Telefunken’s specialty Analog fabrication facility in Heilbronn Germany. Proprietary processes such as SOI (Silicon-on-Insulator), a 700 Volt high-voltage process and a high-speed SiGe (Silicon-Germanium) process enable the new devices to meet the highest performance standards at the lowest power consumption.

“The technology industry, in fact the entire world is looking for the highest efficiencies without sacrificing performance”, said Dr. Volker Dudek, CTO at TELEFUNKEN Semiconductors. “With our specialty process capability we have a unique ability to address some of the technical challenges the industry is facing, such as supporting high voltages with minimal device parasitic.” The first devices out of the gate at TELEFUNKEN are Interface devices, extended common mode LVDS drivers and receivers. LVDS (Low-Voltage-Differential-Signaling) is used extensively for routing data and video at high-speeds while requiring minimal power. Conventional LVDS has an attractive ratio of bandwidth to power consumption but is limited in distributed systems because of the relatively narrow common mode. Telefunken’s extended common mode LVDS devices meet the full RS-485/422 common mode of -7 to +12V, compared to the LVDS standard of 0 to 2.4Volts. These new LVDS devices offer greatly improved bandwidth and a substantial reduction in power consumption and EMI compared to RS-485/422. Typical applications for these types of product are Telecom box-to-box, Factory Automation, Instrumentation, Signage and Avionics. The quad drivers and receivers meet or exceed the LVDS standard while adding a tremendous amount of additional margin in the common mode. More information at www.telefunkensemiconductor.com/products/index.html.

click here to download this information

TFSMART2 - The New Generation Of SOI-based 0.35um BCDMOS is NOW ready for Mass Production

Wed, 08 Sep 2010 17:40:00 +0400

TELEFUNKEN Semiconductors announces today the availability of TFSMART2, the next generation of its well-proven TFSMART1 SOI-based technology designed to meet the needs of its customers worldwide. This new generation BCDMOS technology is based on Telefunken’s proprietary 26-mask high performance SOI process. With an average gate density of 14000 gates/ mm², this technology is ideal for system-on-chip (SOC) designs.The customer can benefit significantly from higher digital integration density and very high voltage DMOS devices operating up to 80 V. All DMOS devices are optimized in terms of power capability and RDSon resistance, enabling new application areas with high-voltage requirements. Compared to similar bulk BCDMOS technologies, the on-resistance of the driver stages is reduced by about 30% for a given area, and the total trench isolation process technology improves additional circuit density. As a result, it has become a more cost effective alternative to the conventional bulk silicon based technology in many applications. "TFSMART2 is another key development with significant importance due to its superb performance and the number of current and potential applications, particularly in the growing areas as Power Management Market. TELEFUNKEN is fully prepared to serve the needs of our customers", said Dr. Volker Dudek, CTO of TELEFUNKEN Semiconductors. The TFSMART technologies are superior to conventional bulk technologies: The advantages of SOI include reducing or eliminating parasitic elements; for example, the application of negative voltages, latch-up free and higher integration density. Highest device performance combined with outstanding reliability and ESD performance makes the technology the first choice for all harsh environments. The highly efficient TFSMART2 technology is very attractive for a broad range of high-volume applications such as motor drivers, power management systems, digital audio amplifiers, and ADSL physical devices. click here to download this information